• The upper layer and lower layer of logic board for iPhone X is weld together, before repairing, you need to disassemble the 2 layer board, then attach them together after repair is done. If the problem on the motherboard can not be solved, you need to repeat the disassembly and reassembly operation, which is easy to produce chip virtual welding, CPU tin damage and other problems! Therefore, the motherboard test fixture perfectly solve the problems and offer professionals more effiecient repair.
  • Features:
  • Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speed.
  • Check-in advance to avoid duplicate disassembling and breaking the motherboard.
  • Mini design, easy to carry.
  • Special Premium quality material
  • Preferred needle plate quality
  • High precision for holding iPhone X Xs Xs Max motherboard
  • Advanced inspection to avoid any damage because of repeated disassembly and installation