Feature:

• Electri heating constant temperature design, removing glue and planting tin is easy to operate.
• Universal iphone chip positioning and glue removal tin planting, layering and bonding.
• 100% brand new, high quality
• No need the hot air rework station
• Use for iPhone x motherboard separate, remove glue
• Mini size, can put under microscope for use,easy to observe
• The main unit cannot be used alone, and it needs to be equipped with a dedicated positioning plate and steel mesh.