- 1. Adopting 185-degree layered process to remove the IP-X motherboard, not only from our fine analysis of IP-X solder paste ,but depends on the special heating design and precise temperature control of SS-T12A.
- 2. SS-T12A only heats the area that the IP-X board needs to be removed to prevent improper heating.
- 3. Dual bayonet design, make sure the IP-X motherboard is stable on the stage.
- 4. High purity copper is used as a film to ensure uniform heat transfer and heat.