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MSM8916/MSM8953 BO1-AB CPU BGA STENCIL SAM 6

170

MODEL ; C7010 / J610 / C7 / J3 / J5 / A5

170

2

Features:

3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented Middle Layer Motherboard.
Assisting professionals to do BGA reballing in the most convenient and safest way.

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MSM8916/MSM8953 BO1-AB CPU BGA STENCIL SAM 6
MSM8916/MSM8953 BO1-AB CPU BGA STENCIL SAM 6

170

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