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MECHANIC X preheating platform for layer and combine the motherboard

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MECHANIC iPhone X preheating platform for layer and combine the motherboard

3,480.84

three major functions:IPX mainboard layering,lamination,A11 postition and glue removal .imported synthetic stone ,innovative depression type buckle design ,guarantee the stable of IPX mainboard ,pure copper heat transfer sheet emsure the stable and uniform heat transfer.

the suitable disassemble and laminating constant temperature 185 degrees ensure the fast and accurate three minutes operation without hurting the mainboard .small and portable .Desoldering free of air guns ,free of soldering iron ,free of host ,plug and play ,extremely fasting heating

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