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MECHANIC WELSOLO VS11 STENCIL BGA REBALLING FOR SDN845/ PM670A/L

300 195

300 195

(-35%)
2

The stepped stepping design allows the stencil to align with the position of the ic lead quickly. – Square hole design makes it easier to remove the formed solder ball. – This 3D Stencil is easy to use, no matter you are new or expert. – High success rate from tin planting, solder balls can be formed after you are proficient. -The 3D planting stencil is thicker than ordinary stencils on the market. The tendency of deformation which is – —— less makes the usage life becomes longer.

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MECHANIC WELSOLO VS11 STENCIL BGA REBALLING FOR SDN845/ PM670A/L
MECHANIC WELSOLO VS11 STENCIL BGA REBALLING FOR SDN845/ PM670A/L

300 195

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