• Professional advanced UV-559 BGA soldering paste flux+squeeze tube +free needle tip.
  • 100% new brand and high quality.
  • Good immersion and high intensity joint.
  • Easy to peel off with hands or tweezers, leave no residue.
  • Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
  • Prevent contamination during assembly.
  • UV-559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips.
  • UV-559 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
  • High soaking high strength joints.
  • No-toxic, no-corrosive, strong ability of insulation.
  • Good insulation and smooth welding surface.
  • No deterioration no dry.
  • No poison no orrosion, no damage to parts


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