MECHANIC Lead Free BGA solder ball 0.25mm

MECHANIC solder ball 10000PCS/Bottle

Our BGA solder ball has the following characteristics:

• . Meet EU ROHS and REACH standards.
• .With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
• . Purity and sphericity are very high, no surface defects.
• .Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
• .The minimum diameter of the solder ball 0.20mm, non-standard sizes can be customized according to customer requirements.
• .When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.