- Uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on the motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board
- PCB repair platform added CPU positioning structure. No manual positioning needed, improve the success rate.
- PCB repair platform designed with integrated layer tin planting function. The precision stencils are produced by the world’s leading laser technology.
- PCB repair platform added motherboard layer separation and positioning installation structure.
- Designed with precision positioning column, it will make efficient repairs for separating, soldering, and installation.
- Pure copper heat conduction material is dealt with a special process so that surface color will keep new.
- Apply imported synthetic stone materials, a number of testing and improved precision processing with 500-degree high-temperature direct heating, durable and no deformation
- Precise snap design, do not hurt the motherboard