₹846.61 ₹465.25
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Innovative technology for removing glue from pads, creating a glue removal blade that won’t damage the pad. when removing the glue, it can provide better protection of chip’s pads no damage and no solder joint dropped.
AUTONOMOUS GRINDINGÂ
REMOVE GLUE WITHOUT TRACE
Clean the residual glue and edge glue of the pad quickly without leaving trace
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