- Professional advanced UV-559 BGA soldering paste flux+squeeze tube +free needle tip.
- 100% new brand and high quality.
- Good immersion and high intensity joint.
- Easy to peel off with hands or tweezers, leave no residue.
- Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
- Prevent contamination during assembly.
- UV-559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips.
- UV-559 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
- High soaking high strength joints.
- No-toxic, no-corrosive, strong ability of insulation.
- Good insulation and smooth welding surface.
- No deterioration no dry.
- No poison no orrosion, no damage to parts