Mechanic Dot Repairing Spot Welding Pad Soldering Lug For Phone Welding Board Fly Wire Replacement Motherboard IC Repair

Product Features :-

  • The pads are reinforced with fixed pins and will never fall off.
  • it adopts industrial-grade printed circuit board copper foil with a thickness of 30um.
  • Good flatness, which can prevent pseudo soldering effectively caused by unevenness. 
  • The BGA bonding surface has high saturation, stable electrical performance, good welding strength, and 
  • it is not easy to drop off and unsoldering. 
  • The connection joint with the circuit is firm, and can fixed the green oil (UV curing solder mask ink) well.
  • it saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high.