MECHANIC solder ball 10000PCS/Bottle
Our BGA solder ball has the following characteristics:
- . Meet EU ROHS and REACH standards.
- .With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
- . Purity and sphericity are very high, no surface defects.
- .Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
- .The minimum diameter of the solder ball 0.20mm, non-standard sizes can be customized according to customer requirements.
- .When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.