MaAnt Divine Furnace SL-1 Deicing by Magic Furnace for IC Chip Heating De-gumming and De-tinning Platform
Product Features :-
One-button heating, rapid heating, the temperature can be adjusted 160-250C, support multi-generation Apple, Huawei chip glue removal, tin removal work.
This applies to 99%of the chips on the market, 20mm x 18.5mm working area, supports multiple generations Apple mobile phone chip, Huawei mobile phone chip universal hard disk, and CPU Glue detinning.
When heating, the temperature can be adjusted between 160℃ and 250℃, effectively avoid due to high temperatures or improper training Burn-out chip.
After opening the glue removal table and heating it to the set temperature, you can use the brush or cotton ball and a cotton swab to remove the residual tin.
No tin line, a wipe can easily remove tin and glue, and easy and quick tin planting.
Air gun heating is safer than 100 degrees lower than air gun temperature scraping.
No soldering iron heating without repeated scraping of a soldering iron, no damage to the pad.
After heating to a set temperature, use a cotton swab, which can handle clean residual tin without damage to the pad paint Non-absorbent tin brings back the wipe that wears the chip for a long time.
Fast heating, no leakage, no static electricity, safer curve heating, built-in professional adjustment curve, no need to worry, about chip damage caused by thermal stress.
According to the needs of the job, set the temperature adjustment to you, the required temperature, one-click Heat up quickly, no need to worry about temperature over the damaged chip.
Hidden screw, flexible and light, flexible telescopic clamping at the same time, the hidden screw prevents the residue from falling into the screw and is more, durable and useful.
Fast charger support heating work, work want do it right where you are, anytime, anywhere professional.
