Description :

100g Kingbo RMA-218 Solder Flux  Paste for BGA PCB Repairing

Brand : Kingbo
Model : RMA-218
Volume : 100g

The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.
Good formula for BGA reballing / balls worksit can stick the balls much more.

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kingbo flux paste


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Kingbo Flux RMA 218

The basic mechanism of soldering is controlled by the solubility of 2 metals together. For the formation of an inter metallic bond, the metallic surfaces must be free of any contaminants, and particularly metal oxides. In soldering, the function of flux is to chemically react with oxides and quickly produce a fresh, oil free, and oxide free surface at soldering temperatures so that the inter metallic bond can take place.

Fluxes can be generally classified into 4 types based on their constituents and activity.

0.1 Inorganic acid

0.2 Organic acid

0.3 Rosin

0.4 No clean


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Packaging Details

  • Unit Type: piece
  • Package Size: 25cm x 32cm x 5cm (9.84in x 12.60in x 1.97in)
  • Package Weight: 0.56kg (1.23lb.)