MECHANIC IPX 3D BGA Reballing Stencil Kit for iPhone X
S30-TO.12mm planting tin black stencils with imported material
The new definition of the new 3D black stencil applies the latest high precision special surface black coating process with the function of anti-oxidation, anti-corrosion, anti-damage, high oleophobic, which makes stencil more durable.
High grade material makes high temperature resistance of 500 degrees, no bulge, no deformation, laser cutting mesh, quadrangle hole design and embedded 3d groove technology.
There is reasonable integrated chip mesh layout, and quadrangle roundness precise hole location
The side is pressed for tweezers to prevent the chip from shifting during tin planting process