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Magic Pad Multi-Functional Positioning Presssure-Reducing Protective Pad for BGA CPU IC Reballing Magic Pad

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Original price was: ₹1,000.00.Current price is: ₹519.00.

Magic Pad Multi-Functional Positioning Presssure-Reducing Protective Pad for BGA CPU IC Reballing Magic Pad

Product Features :-

  • WHAT IS IT FOR? – This Magic Pad is specifically designed for the reballing BGA CPU IC, replacing the front camera and infrared camera cable, also used for repairing iPhone face ID dot matrix cables.
  • CPU PROTECTION – When using this mat to repair a CPU the design offers more protection to the CPU when you do things such as planting tin.
  • SAFE CAMERA REPAIR – It is much safer to use this mat when repairing the front camera or the infrared camera cable, as this mat helps to avoid camera blurring caused by the heat.
  • HEAT RESISTANT – Keeps it shape when under extreme heat, making it perfect for reballing work.
  • PARTS SECTIONS – Perfectly sized areas for resting parts and keeping your workspace organised.
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