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BABA REBALLING STENCIL FOR OPPO/VIVO OV2

170

MODELS : MSM8916 / 8939 / 8940 CPU

170

1

Features:

3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented Middle Layer Motherboard.
Assisting professionals to do BGA reballing in the most convenient and safest way.

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BABA REBALLING STENCIL FOR OPPO/VIVO  OV2
BABA REBALLING STENCIL FOR OPPO/VIVO OV2

170

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