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1. RMA-223 is a moderately active rosin-type solder paste, which is widely used in the SMD rework process of mobile phone boards.
2. For the no-clean solder paste, the color of the residue is very light and has a very high SIR value. It is recommended for BGA, CSP and other ball array solder joint rework and ball replacement.
1. RMA-223 is a moderately active rosin-type solder paste, which is widely used in the SMD rework process of mobile phone boards.
2. For the no-clean solder paste, the color of the residue is very light and has a very high SIR value. It is recommended for BGA, CSP and other ball array solder joint rework and ball replacement.
