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X/XS/XSMAX BGA Stencil With Magnetic PCB Holder- Ma Ant M3

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1,900 1,499

Feature:

  • Electri heating constant temperature design, removing glue and planting tin is easy to operate.
  • Universal iphone chip positioning and glue removal tin planting, layering and bonding.
  • 100% brand new, high quality
  • No need the hot air rework station
  • Use for iPhone x motherboard separate, remove glue
  • Mini size, can put under microscope for use,easy to observe
  • The main unit cannot be used alone, and it needs to be equipped with a dedicated positioning plate and steel mesh.

1,900 1,499

(-21%)
1

3 IN 1 Ma Ant M3 BGA Reballing Fixture FOR iPhone X/XS/XSMAX

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X/XS/XSMAX BGA Stencil With Magnetic PCB Holder- Ma Ant M3
X/XS/XSMAX BGA Stencil With Magnetic PCB Holder- Ma Ant M3

1,900 1,499

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