Model- S
Seperate the CPU and Nand flash
Model-E
Mobile phone motherboard IC CPU glue removal
Model- X
Professional side glue removal tool
Model- Y
Cut the underfill black glue without hurting the motherboard
₹600.00
Seperate the CPU and Nand flash
Mobile phone motherboard IC CPU glue removal
Professional side glue removal tool
Cut the underfill black glue without hurting the motherboard
In stock
Seperate the CPU and Nand flash
Mobile phone motherboard IC CPU glue removal
Professional side glue removal tool
Cut the underfill black glue without hurting the motherboard
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Shipping By | Shipping Cost | Estimated Delivery Time | Tracking Information |
Thembay Express | Free Shipping | 12-20 days | Not available |
LEX | $20.00 - $50.00 | 04-12 days | Available |
Lorem Ex | $26.00 - $70.00 | 03-17 days | Available |
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