- 21%
X/XS/XSMAX BGA Stencil With Magnetic PCB Holder- Ma Ant M3
Feature:
- Electri heating constant temperature design, removing glue and planting tin is easy to operate.
- Universal iphone chip positioning and glue removal tin planting, layering and bonding.
- 100% brand new, high quality
- No need the hot air rework station
- Use for iPhone x motherboard separate, remove glue
- Mini size, can put under microscope for use,easy to observe
- The main unit cannot be used alone, and it needs to be equipped with a dedicated positioning plate and steel mesh.
Original price was: ₹2,066.75.₹1,630.55Current price is: ₹1,630.55.